Component Depackaging
We open electronic components using a proprietary etching process that removes the epoxy package while preserving delicate gold and copper wire bonds; exposing the die for high-energy beam testing required for space qualification. The same technique is also a powerful tool for counterfeit verification.
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Close-up of a delidded QFN package, die and bond wires fully exposed
Delidded package on a test PCB, ready for die inspection
Delidded component soldered on a populated PCB
Component depackaged directly on the PCB to reveal the die
Delidded package showing the lead frame and bond wires
Before and after: an intact package next to its delidded counterpart
A selection of packages processed with our depackaging technique
About this service
Component depackaging reveals the die inside a plastic-encapsulated part, so it can be inspected or tested. Several aerospace start-up companies already use and highly depend on this service.
Good to know
- Please provide at least 3 samples of each component, as the etching process can be delicate and some samples may not survive it.
- Depackaging can be performed on an individual component or directly on a populated PCB.
- The service is provided without warranty on the outcome, as results depend on the specific package and materials.
- Turnaround time is very fast.
- In some cases, a component cannot be successfully depackaged; when that happens, you will not be charged.