Back-end process
Description: Allows samples drying without stiction problems
Sample holder: up to 1 x 6" wafers
Description: Automatic chemical-mechanical polishing equipement
Sample holder: from 3" to 8" wafers
Description: Abrasive thinning of semiconductor wafers
Sample holder: up to 8 x 3" wafers ( 1x6" after upgrade )
Precision: 3 μm
Description: Dicing saw equipement
Sample holder: up to 4" wafers
Materials: Si, glass, quartz
Thickness: up to 1mm
Die: min. 2 x 2 mm2
Description: Wedge bonding equipement
Wire: 20 μm Al or Au wire
Contact pads: min. 70 x 70 μm2