Lithography

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Suss MA/BA6 Mask and Bond aligner

Funding: Feder/Wallonia

Description: Manual mask/bond aligner with front side and back side alignment capabilities.

Sample holder: up to 6" wafers ( 8" wafer upgrade possible )

Resolution: down to 0.4 μm

Mode: Vacuum, Proximity, Hard Contact, Soft Contact

K&W MA 1006

Description: Manual mask aligner with front side and back side alignment capabilities.

Sample holder: 3" wafers

Resolution: down to 0.6 μm

Mode: Proximity, Hard Contact, Soft Contact

FEI XL30 Feg

Description: SEM FEG equipped with a Raith laser interferometer controlled stage and the Elphy Plus software.

Sample holder: 3" wafers

Resolution: down to 10 nm

Obducat NIL-3M

Description: Nanoimprint lithography system.

Sample holder: max 3" wafer size

Resolution: down to 10 nm