Lithography
Funding: Feder/Wallonia
Description: Manual mask/bond aligner with front side and back side alignment capabilities.
Sample holder: up to 6" wafers ( 8" wafer upgrade possible )
Resolution: down to 0.4 μm
Mode: Vacuum, Proximity, Hard Contact, Soft Contact
Description: Manual mask aligner with front side and back side alignment capabilities.
Sample holder: 3" wafers
Resolution: down to 0.6 μm
Mode: Proximity, Hard Contact, Soft Contact
Description: E-beam lithography system with a laser interferometer-controlled stage.
Sample holder: 2 x 2 cm2
Resolution: down to 10 nm
Description: Nanoimprint lithography system.
Sample holder: max 3" wafer size
Resolution: down to 10 nm