Jean-Pierre Raskin

Jean-Pierre Raskin (IEEE M’97, IEEE SM’06, IEEE F’14) was born in Aye, Belgium, in 1971. He received the Industrial Engineer degree from the Institut Supérieur Industriel d’Arlon, Belgium, in 1993, and the M.S. and Ph.D. degrees in Applied Sciences from the Université catholique de Louvain (UCLouvain), Louvain-la-Neuve, Belgium, in 1994 and 1997, respectively. From 1994 to 1997, he was a Research Engineer at the Microwave Laboratory, UCLouvain, Belgium. He worked on the modeling, characterization and fabrication of MMIC’s in Silicon-on-Insulator (SOI) technology for low-power, low-voltage applications.

In 1998, he joined the EECS Department of The University of Michigan, Ann Arbor, USA. He has been involved in the development and characterization of micromachining fabrication techniques for microwave and millimeter-wave circuits and microelectromechanical transducers/amplifiers working in harsh environments. In 2000, he joined the Microwave Laboratory of UCLouvain, Louvain-la-Neuve, Belgium, as Associate Professor, and he has been a Full Professor since 2007. From September 2009 to September 2010, he was visiting professor at Newcastle University, Newcastle Upon Tyne, UK. He was the head of the Electrical Engineering Department of UCLouvain between 2014 and 2017.

His research interests are the modeling, wideband characterization and fabrication of advanced SOI MOSFETs as well as micro and nanofabrication of MEMS / NEMS sensors and actuators, including the extraction of intrinsic material properties at nanometer scale.

He is IEEE Fellow, European Microwave Association (EuMA) Associate Member, Société de l’électricité, de l’électronique et des technologies de l’information et de la communication (SEE) Senior Member, Material Research Society (MRS) Member, and European Association of Service-Learning in Higher Education (EASHLE) Member. He was the recipient of the Médaille BLONDEL 2015, famous French reward that honors each year a researcher for outstanding advances in science which have demonstrated a major impact in the electrical and electronics industry. He received the SOI Consortium Award 2016, the European SEMI Award 2017, and the Médaille AMPERE 2019 in recognition in his vision and pioneering work for RF SOI. In 2017, he received with the NGO Louvain Cooperation the prestigious European Global Education Innovation Award.
He is author or co-author of more than 350 scientific journal articles.

Jean-Pierre’s complete professional resume is available here.


All publications:

All publication in the field of RF-SOI:

Selected publication in the field of RF-SOI:

All publication in the field MEMS-based lab-on-chip:


A list of all awards pertaining to Jean-Pierre’s work is available here.

Other Fields of Research

Beyond working on RF-SOI, Jean-Pierre oversees research projects in other fields, in particular:

  • MEMS-based lab-on-chip electro-mechanical testing.
      • Information available here.
  • Paper-based sensors
      • Information available here.