Shiqi Ma

Shiqi Ma was born in ShaanXi, China, in 1993, and received his B.S. degree in Electrical Engineering and Automation from Northwestern Polytechnical University in 2015. He received his first M.S. degrees in Computer Control Engineering from University of Technology Sydney in 2017, and his second M.S. degrees in Microwave Engineering from Beijing Institute of Technology in 2018. Then he worked at Ferdinand-Braun-Institute, Germany mainly focusing on integrated power sensor design and large signal characterization until 2021. He is currently persuing a PhD degree at the electrical engineering department of UCLouvain.

Research Projects

  • Modelling and fabrication of silicon-filled waveguide component using DRIE(Deep reactive ion etching).
  • On-wafer RF & mm-wave measurements.

 

  • Study on monolithic integration of GaAs Schottky diodes on silicon for THz application.
  • Modelling, fabrication, and charaterization on porous silicon waveguide platform.

Publications

Conference Proceedings

  1. Ma, S., Krozer, V., & Heinrich, W. (2020, November), “Design of an Embedded Broadband Thermoelectric Power Sensor in the InP DHBT Process”, In 7th International Electronic Conference on Sensors and Applications (ECSA-7), doi.

  2. Ma, S., Wang, X., Gao, H., Zhang, M., & Liu, C. (2017, December), “A Wideband Double-Layer E-shaped Microstrip Antenna”, in 2017 International Conference on Computer Systems, Electronics and Control (ICCSEC) (pp. 1667-1670). IEEE, doi.

  3. Ma, S., Nabet, M., Hanus, R., Raskin, J.P., Francis, L.A. and Lederer, D., 2024, May. Towards Porous SI THz Planar Waveguides in Ultra-Low-Resistivity Substrates. In 2024 15th Global Symposium on Millimeter-Waves & Terahertz (GSMM) (pp. 225-227). IEEE.

  4. Delait, L., Tian, Z., Rack, M., Ma, S., Courte, Q., Rennings, A., Craeye, C., Raskin, J.P. and Lederer, D., 2024, September. Planar Leaky-Wave Antenna Design on Thick Substrate by Radiating Surface Waves Using Strip Rings. In 2024 49th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz) (pp. 1-2). IEEE.

  5. Delait, L., Tian, Z., Rack, M., Ma, S., Courte, Q., Rennings, A., Craeye, C., Raskin, J.P. and Lederer, D., 2024. Silicon Resistivity Impact on Surface Waves for Antenna on-Chip Applications. In 2024 Asia-Pacific Microwave Conference (APMC). IEEE.

  6. Tian, Z., Zhang, M., Ma, S., Sievert, B., Yuan, H., Lederer, D., Raskin, J.P., Roskos, H.G., Erni, D. and Rennings, A., 2023, December. The Concept of a Large-scale Subharmonic Coherent Detector Array at 600 GHz. In 2023 Asia-Pacific Microwave Conference (APMC) (pp. 470-472). IEEE. (Best paper award)

  7. Ma, S., Nyssens, L., Raskin, J.P. and Lederer, D., 2023, September. Sub-mmWave Transmission Lines on Silicon-Based Technologies. In 2023 53rd European Microwave Conference (EuMC) (pp. 42-45). IEEE.

Journal Papers

  1. Zhang, M., Wang, X., Yuan, X., Gao, H., & Ma, S. (2019), “A 340-GHz thin film polarisation converter”, International Journal of Electronics, 106(4), 634-647, doi

  2. Li, Y., Liu, Y., Zhu, J., Ma, S., Niu, Z., & Guo, R. (2018), “Spatio-Temporal Road Scene Reconstruction using Superpixel Markov Random Field”, doi.

  3. Huang, Y., Liu, F., Cristoloveanu, S., Ma, S., Nabet, M., Yan, Y., Li, B., Li, B., Nguyen, B.Y., Han, Z. and Raskin, J.P., 2024. CV characterization of the trap-rich layer in a novel Double-BOX structure. Solid-State Electronics, 218, p.108951.

  4. Nyssens, L., Ma, S., Rack, M., Lederer, D. and Raskin, J.P., 2023. Probe-Dependent Residual Error Analysis for Accurate On-Wafer MOSFET Measurements up to 110 GHz. IEEE Journal of the Electron Devices Society, 11, pp.650-657.