Côme Wallner was born in Singapore, in 2001 and is French. He received his M.Sc. degree in electrical engineering in 2024. He is currently pursuing a PhD at the electrical engineering department at UCLouvain in collaboration with IMEC.
His research focuses on the optimization of heterogeneous integration platforms for 6G applications, in partnership with IMEC’s 3D technology and RF experts, aiming at the co-optimization of RF interposers.
Research Projects
On-wafer RF & mm-wave measurements.
Characterization of RF interposer.
Si-substrate loss mitigation techniques.
Design and modelling of passive components and active chip.