Below are listed the open positions within the UCLouvain RF SOI Group.
We are always seeking bright curious minds to join our team, on research involving integrated CMOS technologies for RF and mm-wave applications, from device and substrate material characterization and engineering to front-end circuit designs, and more, under the supervisions of profs. Jean-Pierre Raskin and/or Dimitri Lederer.
Spontaneous applications for research topics in this field other than those open positions listed below can be made, please make use of our contact form.
Open Positions
mm-Wave-IC design - PhD Research
Field:
Emerging state-of-the art SOI technologies offer Silicon-based technologies present a cost and volume-manufacturing advantage over other materials thanks to a high maturity of silicon processes available on 300 mm diameter wafers.
Today, the most advanced CMOS nodes, and in particular the SOI flavors, are boasting impressive high frequency figures of merit, proposing an attractive path for cost-effective mass market productions of RF and mm-wave applications, including 5G, connected objects and smart sensors (Internet of Things), radars, etc.
The proposed research will address implementing innovative mm-wave Front-End-Module circuits (Switch, LNA, PA, VCO, Mixer, etc.) in SOI technologies and evaluating the performance for key operation frequencies of interest, such as 28 GHz, 39 GHz, 60 GHz and 140 GHz. The research involves:
- IC design using Cadence and Foundry-provided design kits.
- Developing high-frequency on-wafer measurement solutions, including accurate calibration and de-embedding steps.
- Working closely with our IC design collaborators to develop pertinent front-end modules targeting specific mm-wave applications.
Profile:
Graduate student of electrical engineering with knowledge of microwave circuit theory (S-parameters, matching circuits, noise figure, etc.)
Contact: