Werner Weber, Dr., IEEE Distinguished Lecturer, Infineon Technologies, Munich, Germany.
3D Stacking of Silicon Chips
In this presentation recent trends in the semiconductor industry are highlighted tracking the transfer from Moore’s law-driven developments in the 80s and 90s to the more recent ‘More than Moore’ hype. Becoming more specific, different 3D integration trends are discussed including finepitch and coarsepitch interchip vias for vertical chip stacks, Molded Interconnect Devices, bare dies in Printed Circuit Boards, and a few more. Finally this talk will highlight the present situation in exploitation of those technologies and open up the discussion of the effect of 3D integration on the value chain of the entire electronics industry.
The conference will be held on the 21st June at 11:15 in the EPL buildings (SUD 06 lecture hall, place Croix du Sud, Louvain-la-Neuve).
Drinks and appetizers will be served after the presentation and question-and-answer session.
Werner Weber received the Dipl. Phys. degree from the Technische Universität München in 1976 and the Dr. rer. nat. degree from the Ludwig-Maximilians-Universität München in 1981. In 1981/82 he was on a one-year assignment at the IBM Thomas J. Watson Research Center, Yorktown Heights, NY, where he worked in the field of semiconductor thin films. 1983 through 2005 he was with the Research Laboratories of Siemens AG and later Infineon Technologies, both Munich, Germany. 1983 through 1998 he was engaged in MOS device physics and basic circuit design and has managed projects on technology-related circuits in advanced memories. From 1998-2005 he was responsible for the Laboratory on Emerging Technologies at Infineon’s Corporate Research which addressed various topics in connection with ambient intelligence such as wearable electronics, smart textiles, ubiquitous sensor networks, and distributed low-cost electronics. Since 2005, he has been managing publicly funded research projects on 3D integration and backend processing for automotive and energy saving applications. Werner Weber has authored or co-authored about 200 scientific papers, gave numerous invited presentations at international conferences, and received various awards. In 2000 and 2001, respectively he received Certificates of Appreciation for his editorial work for the Transactions on Electron Devices and as EDS VLSI Technology & Circuits Committee Chair. Presently, he is active in the IEEE Corporate Recognition and the IEEE Andrew S. Grove awards committees. He is a member of the German Physical Society (DPG) and a Fellow of the IEEE.
More information about Infineon Technologies on their website.
