Note from June 29, 2020
Although we do not yet know how long the social distancing related to the Covid-19 pandemic will last, and regardless of the changes that had to be made in the evaluation of the June 2020 session in relation to what is provided for in this learning unit description, new learnig unit evaluation methods may still be adopted by the teachers; details of these methods have been - or will be - communicated to the students by the teachers, as soon as possible.
Although we do not yet know how long the social distancing related to the Covid-19 pandemic will last, and regardless of the changes that had to be made in the evaluation of the June 2020 session in relation to what is provided for in this learning unit description, new learnig unit evaluation methods may still be adopted by the teachers; details of these methods have been - or will be - communicated to the students by the teachers, as soon as possible.
5 credits
30.0 h + 30.0 h
Q2
Teacher(s)
Francis Laurent (coordinator); Hackens Benoît; Raskin Jean-Pierre;
Language
English
Main themes
Processing of micro and nanoscopic devices, MEMs, NEMs, and integrated circuits :
- - semiconductor materials and their processing,
- - oxidation, ion implantation ionique, doping, metallisation, plasma...
- - micro & nanolithography, laser machining, etc.
- - micro & nanocharacterisation : SEM, AFM, Ellipsometry, Dektak,...
Aims
At the end of this learning unit, the student is able to : | |
| 1 |
Regarding the learning outcomes of the program of "Master in Electrical Engineering", this course contributes to the development and acquisition of the following learning outcomes :
|
The contribution of this Teaching Unit to the development and command of the skills and learning outcomes of the programme(s) can be accessed at the end of this sheet, in the section entitled “Programmes/courses offering this Teaching Unit”.
Content
- types of substrates.
- MOS transistor.
- physical and chemical techniques for thin film deposition: PVD, CVD, PECVD, ALD, etc.
- structure transfer: masking, optical and electronic lithography.
- etching techniques: etching mechanisms, dry and wet etching, RIE, DRIE, IBE, selectivity of etchings, etc.
- special techniques for depositing or engraving thin films.
- metrology elements (microscopy techniques, optics, electrical measurements, physical and chemical analyses,...).
- MOS transistor.
- physical and chemical techniques for thin film deposition: PVD, CVD, PECVD, ALD, etc.
- structure transfer: masking, optical and electronic lithography.
- etching techniques: etching mechanisms, dry and wet etching, RIE, DRIE, IBE, selectivity of etchings, etc.
- special techniques for depositing or engraving thin films.
- metrology elements (microscopy techniques, optics, electrical measurements, physical and chemical analyses,...).
Teaching methods
Students will discuss in groups the elements related to the manufacture of miniaturized devices and will be led to design a complete process using bibliographic materials, supervised laboratory sessions in clean rooms, and interactions with the teaching team. Intermediate reports and presentations with the management team will provide feedback on progress.
Evaluation methods
Continuous evaluation of a semester work carried out in a group, with intermediate presentations and written reports. Individual oral evaluation in examination session.
Online resources
Bibliography
Supports disponibles sur Moodle/supports available on Moodle
Livre de référence/reference book: "Introduction to microfabrication, 2nd ed.", S. Franssila, John Wiley & Sons, 2010
Livre de référence/reference book: "Introduction to microfabrication, 2nd ed.", S. Franssila, John Wiley & Sons, 2010
Faculty or entity
ELEC
