Main themes |
Processing of micro and nanoscopic devices, MEMs, NEMs, and integrated circuits :
- semiconductor materials and their processing,
- oxidation, ion implantation ionique, doping, metallisation, plasma...
- micro & nanolithography, laser machining, etc.
- micro & nanocharacterisation : SEM, AFM, Ellipsometry, Dektak,...
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Aims |
- AA1.1, 1.2, 1.3, AA 2.1, 2.2, 2.3, 2.4, 2.5, AA3.1, 3.2, 3.3, AA4.1, 4.2, 4.3, 4.4, AA5.1, 5.2, 5.3, 5.4, 5.5, 5.6, AA6.1
At the end of the course, the students will be able to :
- Design the process of a particular micro & nanoscopic device.
- Use process simulation tools
- Make specific process steps in the clean rooms
- Characterize step results in WinFab and Welcome platforms
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Content |
The content of this course is the following : decription of fabrication processes for semiconductor integrated devices and circuits, material deposition methods, oxidation, implantation, doping, photolithography, electron-beam lithography, wet ande dry etching, plasma surface treatments, etc. A first project based on the use of numerial simulation tools will help the students to learn more about modelling of fabrication procedures and characterization of integrated devices. The students will have the opportunity to realize some key fabrication steps of a particular complete process flow in the cleanroom facilities during a second project.
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