{"id":13223,"date":"2021-06-29T14:11:59","date_gmt":"2021-06-29T12:11:59","guid":{"rendered":"https:\/\/sites.uclouvain.be\/RF-SOI-group\/?page_id=13223"},"modified":"2024-11-08T13:20:39","modified_gmt":"2024-11-08T12:20:39","slug":"opportunities0","status":"publish","type":"page","link":"https:\/\/sites.uclouvain.be\/RF-SOI-group\/opportunities0\/","title":{"rendered":"opportunities0"},"content":{"rendered":"\t\t
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\n\t\t\t\t\t\t\t\t\tBelow are listed the open positions<\/strong> within the UCLouvain RF SOI Group.\n\nWe are always seeking bright curious minds to join our team, on research involving integrated CMOS technologies for RF and mm-wave applications, from device and substrate material characterization and engineering to front-end circuit designs, and more, under the supervisions of profs. Jean-Pierre Raskin<\/span><\/a> and\/or Dimitri Lederer<\/span><\/a>.\n\nSpontaneous applications<\/strong> for research topics in this field other than those open positions listed below can be made, please make use of our contact form<\/span><\/a><\/span>.\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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(1) Open Positions in UCLouvain<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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<\/p>

The Louvain School of Engineering <\/strong>of Universit\u00e9 catholique de Louvain (UCLouvain) is seeking for three RF Device Engineering PhD students (4 years) <\/strong>and one post-doc (3 years) <\/strong>to work on advanced techniques for on-wafer characterization and modelling of Silicon-on-Insulator (SOI) devices in wide frequency and temperature ranges.<\/p>

Louvain School of Engineering <\/strong>has been pioneering and promoting the use of RF-SOI for high frequency applications for over 30 years, and has accumulated decades of experience in the field. We are now recruiting highly motivated and interested candidates to help us with our investigation towards next generation FD-SOI CMOS transistors below 22 nm to tackle applications in the RF and mm-wave domains such as telecommunications, radars, imaging, sensing, etc. Those scientific investigations will be conducted in the framework of several European Chips JU projects (SOIL<\/span><\/a>, ArCTIC<\/span><\/a>, FAMES, Move2THz<\/span><\/a>). The candidates will collaborate with the best universities, research centers (imec (Be), CEA-Leti (Fr), etc.) and companies (STMicroelectronics (Fr), GlobalFoundries (De), SOITEC (Fr), etc.).<\/p>

Key responsibilities include:<\/span> <\/strong><\/p>